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Resin 70SY1

Mar 7, 2016

Product Name: Polyimide Resin

Resin 70SY1

Resin 70SY1is a high performance copper clad laminate used for the polyimide resin, polyimidealternative Kerimid 701 resin system.

Resin 70SY1 isbased on bismaleimide-based polyimide value system, in other chemicalcomposition does not contain DDM and other components, in line withenvironmental protection requirements

 Features:

  • High glass transition temperature and thermal stability;
  • Excellent solvent resistance;
  • Low coefficient of thermal expansion (CTE, T-axis);
  • High copper peel strength;
  • Good storage stability.

 Quality Index

  • Appearance: reddish brown liquid;
  • Solid content: 50-70%;
  • Gel time (171 ℃): 200-600 seconds

 CCL performanceindicators

  • The glass transition temperature (Tg): ≥200 ℃;
  • Flame retardancy (UL-94): VO;
  • Copper foil peeling strength (ibs / in): ≥7

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